Technical Reports
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A status report on the research of HDI technology drivers for Electronics Product Miniaturization
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Dec, 2002
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Printed Circuit Board Technology Centre (PCBTC), The Hong Kong Polytechnic University
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TR1-01A-B |
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A final technical report on advanced Printed Circuit Board (PCB) material using Aluminum Nitride (AIN) as filler
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June 2005
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Printed Circuit Board Technology Centre (PCBTC), The Hong Kong Polytechnic University
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TR1-02
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A final report on the research of Processing technology for Rigid-flex Printed Circuits
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Feb 2007
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Printed Circuit Board Technology Centre (PCBTC), The Hong Kong Polytechnic University
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TR1-03
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A final report on thermal conductive dielectric materials used for metal core printed circuit boards
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Dec 2007
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Printed Circuit Board Technology Centre (PCBTC), The Hong Kong Polytechnic University
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– |
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A final report on Liquid Crystal Polymer (LCP) printed circuit boards
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Nov 2008
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Printed Circuit Board Technology Centre (PCBTC), The Hong Kong Polytechnic University
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– |
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A final report on the development of printed electronics manufacturing technology
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Dec 2009
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Printed Circuit Board Technology Centre (PCBTC), The Hong Kong Polytechnic University
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– |
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The development of a laser selective activation and metallization technology for the manufacturing of ceramic interconnect substrate (CIS)
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Jan 2011
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Printed Circuit Board Technology Centre (PCBTC), The Hong Kong Polytechnic University
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– |
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The development of cost-effective, high-efficient heat dissipation PCBs for high-brightness LEDs
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Aug 2011
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Printed Circuit Board Technology Centre (PCBTC), The Hong Kong Polytechnic University
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– |
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Nanosolder for low-temperature lead-free electronic interconnect applications
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Aug 2011
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Printed Circuit Board Technology Centre (PCBTC), The Hong Kong Polytechnic University
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